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AIA NAS4123-2024

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$53.20

Details

Title HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP) - Rev 2
Published 01/31/2024
Pages 16
Revision 2
DocumentFormat ZIP(Copy/Paste/Networkable)
StadnardNo. AIA NAS4123



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